Job Description

Laser Diode Opto-Mechanical Packaging Engineer

Position Overview
We are seeking a highly skilled Laser Diode Opto-Mechanical Packaging Engineer to join our team. The successful candidate will be responsible for designing and developing innovative opto-electronic packaging solutions for laser diodes.

Key Responsibilities

• Design and develop laser diode packaging solutions for opto-electronic devices such as multi-cell and photonics integrated circuits.
• Perform hermetic testing and ensure product reliability through environmental testing such as HAST and HALT.
• Collaborate with cross-functional teams to identify and resolve design and production issues.
• Conduct packaging design reviews and provide input on design improvements.
• Maintain clean room environment and adhere to safety protocols.
• Utilize expertise in III-V, GaN, GaAs, InGaN, UV, and UV/VIS to improve packaging designs and processes.
• Utilize expertise in bonding and RPCVD to optimize packaging processes for laser diodes.
• Perform failure analysis and implement corrective actions.

Qualifications

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or related field.
• Minimum of 5 years of experience in opto-mechanical packaging of semiconductor devices, specifically laser diodes.
• Expertise in III-V, GaN, GaAs, InGaN, UV, and UV/VIS.
• Expertise in bonding and RPCVD.
• Experience with clean room protocols.
• Experience with hermetic testing and environmental testing such as HAST and HALT.
• Experience with multi-cell and photonics integrated circuits.
• Experience with packaging of laser diodes in Vis, 14-Pin, T0-Cans.
• Strong analytical and problem-solving skills.
• Excellent communication and teamwork skills.

Benefits

Applicants must be authorized to work in the U.S.

Preferred Skills

III-V

GaN

GAAS

Laser diode

InGaN

Optoelectronic

RPCVD

bonding

Clean Room

FAC

Job Tags

Full time,

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